may 2011 doc id 12078 rev 3 1/8 8 emif01-tv01f3 single line ipad?, emi filter and esd protection features emi symmetrical (i /o) low-pass filter high efficiency emi filtering lead-free package 400 m pitch very low pcb space occupation: 0.6 mm 2 very thin package: 0.6 mm high reliability offered by monolithic integration reduction of parasitic elements through csp integration complies with the following standards iec 61000-4-2 level 4 on internal and external pins: ? 15 kv (air discharge) ? 8 kv (contact discharge) mil std 883f - method 3015.7 class 3 application tv analog signal in tv_out interface description the emif01-tv01f3 is a highly integrated array designed to suppress emi/rfi noise and provide impedance matching for mobile phone and portable applications. th e emif01-tv01f3 is in a flip chip package to offer space saving and high rf performance. this low pass filter includes esd protection circuitry which prevents damage to the protected device when subjected to esd surges up to 15 kv. figure 1. pin configuration (bump side) figure 2. device configuration tm : ipad is a trademark of stmicroelectronics. b 1 2 a pin description pin description a1 tv out internal b1 tv out external a2 gnd b2 gnd flip chip (4 bumps) gnd gnd r tv out internal tv out external gnd gnd b1 a1 r www.st.com
characteristics emif01-tv01f3 2/8 doc id 12078 rev 3 1 characteristics table 1. absolute maximum ratings symbol parameter and test conditions value unit v pp internal pins (a1) an d external pin (b1): esd discharge iec 61000-4-2, air discharge esd discharge iec 61000-4-2, contact discharge 15 8 kv t j maximum junction temperature 125 c t op operating temperature range -30 to +85 c p maximum power dissipation 80 c t stg storage temperature range -55 to 150 c table 2. electrical characteristics (t amb = 25 c) symbol parameters v br breakdown voltage i rm leakage current @ v rm v rm stand-off voltage v cl clamping voltage r d dynamic impedance i pp peak pulse current r i/o series resistance between input & output c line input capacitance per line symbol test conditions min typ max unit v br i r = 1 ma 6 8 v i rm v rm = 3 v 0.2 a r tolerance 5 % 75 c line @ 0 v 30 35 pf
emif01-tv01f3 characteristics doc id 12078 rev 3 3/8 figure 3. s21 (db) attenuation measurement figure 4. esd response to iec61000-4-2 (+15 kv air discharge) db 100.0k 1.0m 10.0m 100.0m 1.0g -50.00 -40.00 -30.00 -20.00 -10.00 0.00 f (hz) 10 v/d 100 ns/d 10 v/d tv out internal tv out external figure 5. esd response to iec61000-4-2 (-15 kv air discharge) figure 6. line capacitance versus applied voltage tv out internal tv out external 10 v/d 10 v/d 100 ns/d 0 5 10 15 20 25 30 35 0123456 f=1mhz v osc =30mv rms t j =25c c (pf) line v line (v)
application information emif01-tv01f3 4/8 doc id 12078 rev 3 2 application information figure 7. aplac model figure 8. aplac parameters rline rbump lbump rbump lbump model = d1 i1 o1 lbump rbump lbump rbump model = d2 75p rs ls rs ls port1 port2 i1 o1 variables aplacvar rline 75 aplacvar c_d1 17.5p aplacvar c_d2 17.5p aplacvar ls 950ph aplacvar rs 150m aplacvar lbump96ph aplacvar rbump 20m aplacvar lgnd 75ph diode d1 bv=7 ibv=1m cjo=c_d1 m=0.28 rs=0.48 vj=0.6 tt=100n diode d2 bv=7 ibv=1m cjo=c_d2 m=0.28 rs=0.7 vj=0.6 tt=100n
emif01-tv01f3 ordering information scheme doc id 12078 rev 3 5/8 3 ordering information scheme figure 9. ordering information scheme 4 package information in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 10. package dimensions emif yy - xx zz fx emi filter number of lines information package x = resistance value (ohms) z = capacitance value / 10 (pf) or 2 letters = application 2 digits = version f = flip chip x = 3: lead-free, pitch = 400 m, bump = 255 m 770 m 30 m 185 m 10 m 185 m 10 m 770 m 30m 400 m 40 255 m 40 400 m 40 605 m 55
ordering information emif01-tv01f3 6/8 doc id 12078 rev 3 figure 13. flip chip tape and reel specification note: more information is availa ble in the application notes: an2348: ?stmicroelectronics 400 micro-metre flip chip: package description and recommendation for use? an1751: ?emi filters: recommendations and measurements? 5 ordering information figure 11. footprint figure 12. marking 220 m recommended 220 m recommended 260 m maximum solder stencil opening : copper pad diameter: solder mask opening: 300 m minimum x y x w z w dot xx = marking yww = datecode (y = year ww = week) z = manufacturing location dot identifying pin a1 location user direction of unreeling all dimensions in mm 4 0.1 8 0.3 4 0.1 0.87 0.87 1.75 0.1 3.5 0.1 ? 1.5 0.1 0.71 0.05 xxz yww xxz yww xxz yww table 3. ordering information order code marking package weight base qty delivery mode emif01-tv01f3 hc flip chip 0. 79 mg 5000 tape and reel 7?
emif01-tv01f3 revision history doc id 12078 rev 3 7/8 6 revision history table 4. document revision history date revision changes 09-feb-2006 1 initial release. 28-apr-2008 2 updated ecopack statement. updated figure 9 , figure 10 , and figure 13. reformatted to current standards. 26-may-2011 3 updated figure in table 2. updated ecopack statement.
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